Flat panel display module and method of manufacturing the same

ABSTRACT

A flat panel display module includes a transparent substrate, a light emitting section, a sealing cap, a flexible printed circuit board and a semiconductor device. The transparent substrate with a wiring line terminal section is formed on one of surfaces of the transparent substrate in at least one of opposing ends of the transparent substrate. The light emitting section is provided in a display region in a center section on the surface on which the wiring line terminal section of the transparent substrate is formed. The sealing cap is provided for a sealing region to cover the light emitting section such that ends of the sealing cap does not reach the ends of the transparent substrate or the wiring line terminal section of the transparent substrate. The flexible printed circuit board is connected to the wiring line terminal section and extending along the sealing cap of the transparent substrate. The semiconductor device is mounted on the flexible printed circuit board for the light emitting section.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a flat panel display module and amanufacturing method, and more particularly to a flat panel displaymodule which is made thin and small and a manufacturing method of thesame.

2. Description of the Related Art

As a display unit used in an electronic unit like a mobile phone whichis portable and small, flat panel display units such as an LCD and anorganic EL display are known. Because the module of such a flat paneldisplay unit is incorporated into the portable electronic equipment, themodule is desired to be small and light.

Here, a conventional technique about the flat panel display module isdisclosed in Japanese Laid Open Utility Model Application (JU-A-Heisei1-161597). In this conventional technique, a flat panel display moduleis composed of a transparent substrate (1), a circuit board (18), manyexternal lead connection terminal sections (23), and a the flexible lead(15). The transparent substrate (1) and the circuit board (18) arearranged in a laminate layer and the thickness of the module becomesthick. The flexible lead (15) is connected with the terminal sections(23) of the transparent substrate (1) and is connected with the circuitboard (18). Therefore, the flexible lead (15) is connected to be turnedback. Here, the effective connectable length of the terminal section isequal to or more than twice the connection length of the terminalsection of the flexible lead (15).

Also, a thin film EL display unit is disclosed in the Japanese Laid OpenPatent application (JP-A-Heisei 2-227989). In this conventionaltechnique, like the above-mentioned conventional technique, an organicEL panel (10) and a printed circuit board (30) are arranged in alaminate layer. The flexible printed circuit board (40) turns back twiceafter connection with the organic EL panel (10) and is connected withthe printed circuit board (30), and moreover, is turned back and isconnected with the back of printed circuit board (30). In thisconventional technique, there is a possibility that the wiring lines ofthe flexible printed circuit board (40) are broken. Also, in thisstructure, it is not possible to decrease the thickness of the film ELdisplay unit.

Also, the connection structure of a flat display is disclosed in theJapanese Laid Open Patent application (JP-A-Heisei 6-230728). In thisconventional technique, the flat display is composed of a flat displaypanel (1), a drive board (3), one side the flexible printed circuitboard (14) and a connection cable (17). The one side the flexibleprinted circuit board (14) is provided with the printed circuits with adriver IC (6). The connection cable (17) is connected with the driveboard (3), and is turned back twice and is connected with the one end ofone side the flexible printed circuit board (14). The one side theflexible printed circuit board (14) connected with the connection cable(17) is connected with the driver IC (6) apart from the drive board (3)into a lateral direction. In this way, the connection cable (17) is bentlike the character of S and is possibly broken. Also, because the driverIC (6) is apart from the drive board (3), the size in the lateraldirection cannot be made small.

Also, an organic EL display is disclosed in Japanese Laid Open PatentApplication (2000-3140). In this conventional technique, an organic ELdisplay is composed of a substrate (1), an organic EL structure, asealing plate (2) and a wiring line structure (3). The circuit forsealing plate (2) to do an organic EL structure at the sealing and todrive and to control an organic EL structure is prepared onto thesuperficies. The wiring line structure (3) connects the circuit which isformed on substrate (1) and the circuit of sealing plate (2). Thiswiring line structure (3) section is arranged in the position wheresealing plate (2) on substrate (1) is not arranged. Moreover, the wiringline structure (3) has a circuit on an externally orientated surface. Inthis example, the wiring line structure (3) is composed of some portionsand it is necessary to connect them. Also, the wiring line structure (3)and the sealing plate (2) are connected with the bonding wires.Therefore, the manufacturing method of the organic EL display takeslarge cost and time. Also, because the sealing plate (2) and the wiringline structure (3) are used, it is not possible to reduce the thicknessof the organic EL display.

Also, a display unit is disclosed in Japanese Patent No. 2,612,968. Inthis conventional technique, a flexible printed circuit board is bent tobe turned back from a support plate to a hard printed circuit board.Therefore, there is a fear that a wiring lien is broken. Also, a displaypanel drive circuit is mounted in the hard printed circuit board, andthe hard printed circuit board is provided externally from the supportplate in which a display panel is formed to a lateral direction.Therefore, there is a problem that the size to the lateral direction hasbecome large compared with the display size of the display panel.

SUMMARY OF THE INVENTION

Therefore, an object of the present invention is to provide a flat paneldisplay module which is made small and thin.

Another purpose of the present invention is to provide a manufacturingmethod of a flat panel display module, in which the number of steps canbe reduced and also a process is easy so that the reduction in costs ispossible.

Another purpose of the present invention is to provide a flat paneldisplay module and a manufacturing method, in which a flexible printedcircuit board is connected without being turned back.

Another purpose of the present invention is to provide a flat paneldisplay module and a manufacturing method, in which break of a wiringline in a flexible printed circuit board can be prevented.

Another purpose of the present invention is to provide a flat paneldisplay module and a manufacturing method, in which a flexible printedcircuit board can be connected to a wiring line connection sections atboth opposite ends.

Another purpose of the present invention is to provide a flat paneldisplay module and a manufacturing method, in which it is possible tosurely connect the flexible printed circuit board with very shortterminals.

Another purpose of the present invention is to provide a flat paneldisplay module and a manufacturing method, wherein the connectionsection of the flexible printed circuit board is supported.

Another purpose of the present invention is to provide a flat paneldisplay module and a manufacturing method in which it is possible toapply to an organic EL unit.

In an aspect of the present invention, a flat panel display moduleincludes a transparent substrate, a light emitting section, a sealingcap, a flexible printed circuit board and a semiconductor device. Thetransparent substrate with a wiring line terminal section is formed onone of surfaces of the transparent substrate in at least one of opposingends of the transparent substrate. The light emitting section isprovided in a display region in a center section on the surface on whichthe wiring line terminal section of the transparent substrate is formed.The sealing cap is provided for a sealing region to cover the lightemitting section such that ends of the sealing cap does not reach theends of the transparent substrate or the wiring line terminal section ofthe transparent substrate. The flexible printed circuit board isconnected to the wiring line terminal section and extending along thesealing cap of the transparent substrate. The semiconductor device ismounted on the flexible printed circuit board for the light emittingsection.

The semiconductor device may be mounted on a side of the flexibleprinted circuit board of the sealing cap.

Also, the flexible printed circuit board may have wiring line patternsfor the semiconductor device on both sides thereof in a portioncorresponding to the display region.

Also, the flexible printed circuit board may be provided to extend alongthe transparent substrate and the sealing cap without being turned back.

Also, the flexible printed circuit board may be bent at least twicebetween the wiring line terminal section and the display region suchthat the flexible printed circuit board is approximately parallel to thetransparent substrate in the display region. In this case, the flexibleprinted circuit board may be bent to a first direction opposite to thetransparent substrate in a first position between the wiring lineterminal section of the transparent substrate and the sealing cap, maybe bent to the first direction in a second position between the firstposition and the terminal section of the sealing cap, and may be bent tothe second direction opposite to the first direction in a third positionbetween the second position and the terminal section of the sealing cap.In this case, a bending angle in the first position is within 60degrees.

Also, in the first position, the wiring line pattern of the flexibleprinted circuit board may be formed only on one side. In this case, inthe second position, the wiring line pattern of the flexible printedcircuit board may be formed on both sides and a resist film is applied.

Also, a bending angle in the second position may be within 90 degreesand a summation of the bending angle in the first position and thebending angle in the second position is desirably equal to or less than90 degrees.

Also, the flexible printed circuit board may be bent to the seconddirection approximately parallel to the transparent substrate in thethird position.

Also, a metal film may be formed on the back side of the flexibleprinted circuit board in one or both of the second position and thethird position.

Also, the flexible printed circuit board may be bent to the firstdirection opposite to the transparent substrate in a fourth positionbetween the end of the sealing cap and the end of the light emittingsection, and may be bent to the second direction opposite to the firstdirection in a fifth position between the fourth position and the end ofthe light emitting section. In this case, in the fourth position, thewiring line patterns of the flexible printed circuit board may be formedon both sides of the flexible printed circuit board and a resist film isapplied.

Also, the flexible printed circuit board may be bent to the seconddirection approximately parallel to the transparent substrate in thefifth position.

Also, the flat panel display module may further include a frame providedalong the end of the transparent substrate.

Also, the frame may support the flexible printed circuit board togetherwith the end of the sealing cap.

Also, the wiring line terminal section may be formed on both of thesurface of the opposite ends of the transparent substrate, and theflexible printed circuit board is connected with the both of the wiringline terminal sections.

Also, the wiring line terminal section may be formed on both of thesurface of the opposite ends of the transparent substrate, and theflexible printed circuit board is connected with the both of the wiringline terminal sections.

Also, the light emitting section may be an organic EL film.

Also, the light emitting section may be an organic EL film, and the flatpanel display module may further include a desiccant section between thelight emitting section and the sealing cap in a center section of thedisplay region, the sealing cap has a protrusion section correspondingto the desiccant section. A plurality of the semiconductor devices maybe provided on the flexible printed circuit board on a side of thetransparent substrate between the protrusion section of the sealing capand the end of the sealing cap.

In a second aspect of the present invention, a manufacturing method of aflat panel display module, is attained by (a) forming a display section,wherein the display section include a transparent substrate having awiring line terminal section which is formed on one of surfaces of thetransparent substrate in at least one of opposing ends of thetransparent substrate; a light emitting section provided in a displayregion in a center section on the surface on which the wiring lineterminal section of the transparent substrate is formed; a sealing capprovided for a sealing region to cover the light emitting section suchthat ends of the sealing cap does not reach the ends of the transparentsubstrate or the wiring line terminal section of the transparentsubstrate; a flexible printed circuit board connected to the wiring lineterminal section and extending along the sealing cap of the transparentsubstrate; and a semiconductor device mounted on the flexible printedcircuit board for the light emitting section; by (b) connecting theflexible printed circuit board with semiconductor devices mounted to thewiring line terminal section of the transparent substrate; and by (c)fixing a frame around the ends of the transparent substrate.

Also, the (b) connecting step may be attained by forming the flexibleprinted circuit board; and by mounting the semiconductor devices on theflexible printed circuit board.

Also, the (b) connecting step may be attained by mounting thesemiconductor devices on the flexible printed circuit board; and byforming the flexible printed circuit board with the semiconductordevices mounted.

Also, the forming step of the flexible printed circuit board may beattained by bending the flexible printed circuit board to a firstdirection opposite to the transparent substrate in a first positionbetween the end of the sealing cap of and the wiring line terminalsection of the transparent substrate; by further bending the flexibleprinted circuit board to the first direction in a second positionbetween the first position and the end of the sealing cap; and bybending the flexible printed circuit board to a second directionopposite to the first direction in a third position between the secondposition and the end of the sealing cap.

Also, a bending angle in the first position is equal to or less than 60degrees, a bending angle in the second position is equal to or less than90 degrees, and a summation of the bending angle in the first positionand the bending angle in the second position is equal to or less than 90degrees.

Also, the forming step of flexible printed circuit board may furtherinclude the steps of: bending the flexible printed circuit board to thefirst direction opposite to the transparent substrate in a fourthposition between the end of the sealing cap and an end of the lightemitting section; and bending the flexible printed circuit board to thesecond direction opposite to the first direction in a fifth positionbetween the fourth position and the end of the light emitting section.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a back plan view showing the plane structure of a flat paneldisplay module according to a first embodiment of the present invention;

FIG. 2 is a plan view showing a display section used in the flat paneldisplay module according to the first embodiment of the presentinvention;

FIG. 3 is a cross sectional view showing a section along the long sideof the flat panel display module according to the first embodiment ofthe present invention;

FIG. 4 is an expanded view showing a connection section of the flatpanel display module according to the first embodiment of the presentinvention;

FIG. 5 is a partial cross sectional view showing a section according tothe long side of the flat panel display module according to a secondembodiment of the present invention;

FIG. 6 is a cross sectional view showing a section according to the longside of the flat panel display module according to a third embodiment ofthe present invention; and

FIG. 7 is an expanded view showing an expansion section of theconnection section of the flat panel display module according to afourth embodiment of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Hereinafter, a flat panel display module of the present invention willbe described with reference to the attached drawings. Here, in the flatpanel display module 1 of the present invention, an organic EL(electro-luminescence) device is referred to as a display device.However, the display device is not limited to the organic EL device.

FIG. 1 is a back plan view of the flat panel display module according tothe first embodiment of the present invention from the side of the back.FIG. 2 is a diagram showing a display section used in the flat paneldisplay module 1 shown in FIG. 1. FIG. 3 is a cross sectional view ofthe flat panel display module shown in FIG. 1 in the longitudinaldirection.

Referring to FIG. 1, FIG. 2 and FIG. 3, the flat panel display module 1of the present invention is composed of the display section, a flexibleprinted circuit board 15 and a frame 16. The display section is composedof a transparent substrate 11, a display section 12, a sealing cap 13.

Referring to FIG. 1, the flat panel display module 1 according to thefirst embodiment of the present invention has a approximatelyrectangular shape, and a the wiring line section for connection to anexternal unit extends from the center of one of long sides. A displayregion is provided in the region within the sealing cap at the displaysection and a plurality of semiconductor devices 18 are arranged aroundthe convex section at a the desiccant section in the center of thesealing cap. These semiconductor devices are provided to process thesignals inputted from the wiring line section for the connection to theexternal unit and to drive the display section.

In FIG. 1, one chain line gives an outline of the bent positions whenthe flexible printed circuit board 15 is bent.

The transparent substrate 11 is composed of such a transparent member asa glass plate. The shape of the transparent substrate 11 is a rectanglesubstantively in this example. However, the shape is not limited to it.Referring to FIG. 2, the lower surface section of the transparentsubstrate 11 has a display region 41 and three the wiring line terminalsections 21, 22 and 23.

The terminal region 21 is provided for an end of the long side sectionwhich is opposite to the wiring line section for the external connectionin the lower side of the transparent substrate 11. The wiring lineterminal sections 22 and 23 are provided for ends of the two shorterside sections of the transparent substrate 11 respectively. The displayregion 41 is provided in the central section on the lower side sectionof the transparent substrate 11. In this example, the shape of thedisplay region 41 is a rectangle substantively. The display section isdriven in a matrix manner in response to drive signals supplied to thewiring line terminal sections 21, 22 and 23 from the semiconductordevice. In this way, a desired image is displayed and an image can beseen through the transparent substrate 11.

FIG. 3 shows the structure of the lower side section of the transparentsubstrate 11. Referring to FIG. 3, a light emitting section 12 iscomposed of an organic EL device in this example. The emitting lightsection 12 is formed in the display region 41 of the transparentsubstrate 11 to have a predetermined thickness. The organic EL device isdriven by the semiconductor device 18 and emits light. To protect theorganic EL device against moisture, the desiccant section 17 isgenerally provided onto the organic EL device.

A sealing cap 13 is formed on the lower side section of the transparentsubstrate 11 to cover the light emitting section 12 and the desiccantsection 17, and also to cover the transparent substrate 11 around thelight emitting section 12. However, the ends of the sealing cap 13 donot reach the ends of the transparent substrate 11. The plane shape ofthe sealing cap 13 is a rectangle approximately in this example. Also,the sealing cap 13 has an approximately uniform thickness.

The sealing cap 13 has a first convex section below. The shape of thisfirst convex section corresponds to the shape of the display region 41and is larger than the shape of the display region 24. Also, the sealingcap 13 has the second convex section which protrudes from the firstconvex section far below. The shape of this second convex sectioncorresponds to the desiccant section 17 and has the shape which israther larger than the desiccant section 17. When the desiccant section17 is unnecessary, of course, the second convex section does not exist.The plane of the lower side section of the first convex section and theplane of the lower side section of the second convex section in thesealing cap 13 are parallel to the plane of the transparent substrate 11approximately.

The semiconductor devices 18 are mounted on the flexible printed circuitboard 15. The semiconductor devices 18 are composed of a signalgenerating circuit to generate drive signals based on the input signalfrom the wiring line section for the external connection and a drivecircuit to drive the light emitting section 12 based on the drivesignals. However, depending on the circuit structure, only the drivecircuit it is needed.

Referring to FIG. 1, the shape of the flexible printed circuit board 15is rectangular approximately. However, the wiring line section for theexternal the wiring lines extend from the center section of the one ofthe long side. The wiring line terminal section 31 composed of theterminals which are connected with the terminals which are provided forthe wiring line terminal section 21 of the transparent substrate 11 isprovided for the other end of the long side of the flexible printedcircuit board 15. Also, the wiring line terminal sections 32 and 33which composed of the terminals connected with the terminals which areprovided for the wiring line terminal sections 22 and 23 of thetransparent substrate 11 are provided for the ends of the two shortersides where the flexible printed circuit board 15 is opposite.

Also, in the flexible printed circuit board 15, a cut-out portion isformed in each of the corner sections between the long side sections andthe shorter side sections. These cut-out portions are provided not togive influence to the long side section or the shorter side section whenthe long side section or shorter side section of the flexible printedcircuit board 15 is bent.

The flexible printed circuit board 15 is connected with the wiring lineterminal sections 21, 22 and 23 of the transparent substrate 11 at thewiring line terminal sections 31, 32 and 33. At this time, a wiring lineterminal section is pressed and connected at the A section. In this way,the flexible printed circuit board 15 is arranged along the outersurface of the sealing cap 13 without being bent to be turned back.

Also, the upper surface section of the flexible printed circuit board 15has a first region opposite to the lower side section of the firstconvex section of the sealing cap 13 and a second region opposite thelower side section of the second convex section of the sealing cap 13when the flat panel display module is formed. The first regioncorresponds to the display region and is located in the center sectionof the surface section of the flexible printed circuit board 15. Also,the second region corresponds to the desiccant section 17 and is in thecenter of the first region.

Also, the plurality of semiconductor devices 18 are provided in thefirst region other than the second region in the surface section of theflexible printed circuit board 15 to drive the light emitting section12. These semiconductor devices are connected using the wiring linepattern formed on the both sides of the flexible printed circuit board15. Here, a resist film is applied onto the wiring line pattern.

Of these semiconductor devices 18, a drive circuit element is connectedwith the terminals of the wiring line terminal sections 31, 32 and 33which were formed on the surface section of the flexible printed circuitboard 15. The terminals in the wiring line terminal sections 31, 32 and33 and the terminals in the wiring line terminal sections 21, 22 and 23formed on the lower side section of the transparent substrate 11 arepressed and connected. These circuits allow to the drive signals to besupplied to the light emitting section 12.

Next, the connection of the flexible printed circuit board 15 to thetransparent substrate 11 will be described below.

The length of each terminal in the wiring line terminal sections 21, 22and 23 of the transparent substrate 11 is as very short as about 1.8 mm.Also, the pitch between the terminals is 0.088 mm in the wiring lineterminal section 21 and is 0.272 mm in the wiring line terminal sections22 and 23. The sealing cap 13 is formed to a near portion to the wiringline terminal sections 21, 22 and 23.

FIG. 4 is an expanded drawing of the connection section of the flexibleprinted circuit board 15 to the transparent substrate 11. Referring toFIG. 4, the wiring line patterns are basically printed on the both sidesin the flexible printed circuit board. An insulative resist is appliedonto the wiring line pattern. However, the wiring line pattern is formedonly on the one side in the wiring line terminal section 31 on the longside of the flexible printed circuit board 15 and the wiring lineterminal sections 32 and 33 on the shorter side, and a resist is notapplied.

The length of the terminal of the wiring line terminal sections 31, 32and 33 is equal to or less than 1.8 mm, as described above. In thisexample, the flexible printed circuit board 15 is bent to the firstdirection to leave the transparent substrate 11 in the first position 51apart from the end by 1 mm. Therefore, the length for the flexibleprinted circuit board 15 to be pressed and connected to the transparentsubstrate 11 is about 1 mm and it is very narrow. It is easy for theflexible printed circuit board 15 to be peeled off the transparentsubstrate 11. If the flexible printed circuit board 15 is turned back asin the conventional example, the unnecessary force acts on theconnection point A so that the flexible printed circuit board 15 hasbeen easily peeled off the transparent substrate 11.

In the first position 51, the flexible printed circuit board 15 isfurther bent to the first direction at the angle within 60 degrees. Inthe first position 51, as described above, the wiring line pattern isformed only on the one side and any resist layer is not applied.Therefore, when the flexible printed circuit board 15 is bent to the toolarge angle at a time, there is fear that the wiring line is broken.Therefore, it is desirable that the bend angle is equal to or less than60 degrees. In this example, the flexible printed circuit board 15 isbent by the 30 degrees.

Next, the flexible printed circuit board 15 is bent to the firstdirection in the second position 52 between the first position 51 andthe sealing cap 13. In this position, the flexible printed circuit boardmay have the wiring line patterns on the both sides and may have thewiring line pattern on the one side. In any case, a resist layer isapplied onto the wiring line pattern. The bending angle in the secondposition 52 is within 90 degrees. Because the resist layer is applied tothis position even if the flexible printed circuit board 15 is supposedto have been bent at the larger angle, the wiring line is never broken.Also, it should be avoided that the flexible printed circuit board 15 isbent to turn back, such that unnecessary force acts on the connectionsection of the wiring line terminal section, as described above.Therefore, the bending angle in the second position 52 is desirablywithin 90 degrees. Also, it is desirable that a summation of the bendingangle in the first position 51 and the bending angle in the secondposition 52 do not exceed 90 degrees. In this example, the bending anglein the second position 52 is about 60 degrees.

The flexible printed circuit board 15 is bent to the direction parallelto the transparent substrate 11 approximately in a third position 53with the height which is approximately equal to the thickness of thesealing cap 13. It should be noted that the resist layer is applied tothe flexible printed circuit board 15 on the side of the center in thedisplay region from the second position 52. It is desirable that theflexible printed circuit board has a metal film on at least one side (onthe back side in this example) of the circuit board, in one or both ofthe second position and the third position such that the plasticdeformation property is increased at the bending position. The backplane of the flexible printed circuit board means a plane in which thewiring line pattern is not formed. Also, it is desirable that the metalfilm is formed on the whole back plane. The wiring line pattern is ametal film but separated from the metal film.

The flexible printed circuit board 15 is bent to the first direction ina fourth position 54 between the end of the sealing cap 13 and the endof the light emitting section 12. Moreover, the flexible printed circuitboard 15 is bent to be parallel to the transparent substrate 11 in afifth position 55 corresponding to the maximum height of the sealing cap13.

The bending or forming process as described above is carried outrespectively on the side of the long side and the shorter side in theflexible printed circuit board 15. In this way, the flexible printedcircuit board 15 is arranged along the outer surface of the sealing cap13 from one of the shorter sides to the other thereof in one of thesurfaces of the transparent substrate 11 without being bent to be turnedback. At this time, the space where it is possible for the semiconductordevices 18 to be installed is secured in the region between the fourthposition 54 and the display region.

After the flexible printed circuit board 15 is arranged, the frame 16 isarranged along the ends of the transparent substrate 11. The frame 16has a section of the character “L” and the bottom section extends to thedisplay region. If the upper surface of the bottom section has a contactwith the sealing cap 13 in the B section between the third position 53and the fourth position 54, the flexible printed circuit board 15 can besandwiched and supported by the frame 16 and the sealing cap 13 in the Bsection. Therefore, it is possible to prevent that unnecessary forceacts on the connection section in the wiring line terminal sections 31,32 and 33. In this case, even if the total bending angle including thebending angle in the second position 52 gets to be near 90 degrees orexceeds 90 degrees little, there is no case that the wiring lineterminal sections 31, 32 and 33 peel off the wiring line terminalsections 21, 22 and 23 of the transparent substrate 11.

At this time, depending on the processing precision, there is a casethat the flexible printed circuit board 15 cannot be sandwiched orsupported by the sealing cap 13 and the frame 16. In such a case, aninsulating filling film may be inserted between the sealing cap 13 andthe frame 16.

Next, the method of manufacturing a flat panel display module of thepresent invention will be described below.

First, the light emitting section 12 is formed on the transparentsubstrate 11, and the light emitting section 12 is sealed by the sealingcap 13 so as to complete the display section. Next, the flexible printedcircuit board 15 as described above is prepared. The semiconductordevices are mounted on predetermined positions of the flexible printedcircuit board 15. The flexible printed circuit board 15 is pressed andconnected on the wiring line terminal sections 21, 22 and 33 of thetransparent substrate 11 in the wiring line terminal sections 31, 32 and33. After that, the frame 16 is installed to the transparent substrate11. At this time, it is desirable to sandwich and support the flexibleprinted circuit board 15 by the sealing cap 13 and the frame 16 asdescribed above. In this way, the flat panel display module iscompleted.

It should be noted that the flexible printed circuit board 15 may bebent before the semiconductor devices 18 are mounted thereon or afterthe semiconductor devices 18 are mounted thereon.

Next, the flat panel display module in the second embodiment of thepresent invention will be described. FIG. 5 is a cross section view ofthe flat panel display module in the second embodiment of the presentinvention.

Referring to FIG. 5, in the second embodiment, the bent shape of theflexible printed circuit board 15 is same as the first embodiment.However, the flexible printed circuit board 15 has the wiring lineterminal sections 31 and 32 but does not have the wiring line terminalsection 33. The semiconductor devices are arranged in the sealing regionon the side of the wiring line terminal section 32 and the sealingregion on the side of the wiring line terminal section 33. Here, thesealing region is the region corresponding to the first convex sectionof the sealing cap 13 other than the second convex section. On theshorter side of the flexible printed circuit board 15, the flexibleprinted circuit board 15 is supported by the sealing cap 13 in thesealing region and the frame 16.

Next, the flat panel display module in the third embodiment of thepresent invention will be described. FIG. 6 is a cross sectional view ofthe flat panel display module in the third embodiment of the presentinvention.

Referring to FIG. 6, in the third embodiment, the flexible printedcircuit board 15 has the wiring line terminal sections 31 and 32 butdoes not have the wiring line terminal section 33. Also, thesemiconductor devices are arranged only in the sealing region on theside of the wiring line terminal section 32. On the side of the longside of the flexible printed circuit board 15, the bent shape of theflexible printed circuit board is same as the first embodiment.Therefore, the flexible printed circuit board 15 is supported by thesealing cap 13 in the display region and the frame 16.

Also, on the side of the wiring line terminal section 32 of the flexibleprinted circuit board 15, the bent shape of the flexible printed circuitboard is same as the first embodiment. Therefore, the flexible printedcircuit board 15 is supported by the sealing cap 13 in the displayregion and the frame 16. However, the flexible printed circuit board 15is bent to extend along the second convex section and the first convexsection of the sealing cap 13 on the side of the shorter sidecorresponding to the wiring line terminal section 32. Also, the flexibleprinted circuit board 15 is sandwiched and supported in the C section bya section corresponding to the display region of the sealing cap 13 andthe frame 16.

Next, the flat panel display module in the fourth embodiment of thepresent invention will be described. FIG. 7 is a cross sectional view ofthe flat panel display module in the fourth embodiment of the presentinvention.

Referring to FIG. 7, in the fourth embodiment, the bending process isnot carried out to the flexible printed circuit board 15 in the fourthand the fifth position. Also, the height of the third position from thetransparent substrate 11 is set to be equal to the height of the fifthposition. Therefore, the flexible printed circuit board 15 is neversandwiched and supported by the frame 16 and the sealing cap 13.Therefore, force acts directly on the connection section, but there is amerit that the semiconductor device mounting section can be widely used.

As mentioned above, according to the flat panel display module of thepresent invention, the flexible printed circuit board is connected tothe connection terminal section of the transparent substrate withoutbeing turned back. Therefore, there is no fear that unnecessary forceacts on the connection section so that the flexible printed circuitboard is peeled off the transparent substrate. Also, even if the widthof the connection section is narrow, it is difficult for unnecessaryforce to act, because the flexible printed circuit board is arrangedalong the connection section. Therefore, the flexible printed circuitboard is bent to have a small angle at first, and is next bent to havethe larger angle.

In case of this bending process, the wiring line pattern is never brokenbecause the bending angle is small in the first bending section. Also,there is not fear that the wiring line pattern is broken because thewiring line pattern is protected by the resist layer in this sectionalthough the bend angle is large in the next bending section.

Also, because the flexible printed circuit board is sandwiched andsupported by the frame and the sealing cap, it is difficult for theforce to act on the connection section.

Also, the semiconductor device to drive the light emitting section suchas the organic EL device is provided for the free space from the sealingcap for protecting the light emitting section on the side of the lightemitting section of the flexible printed circuit board. Therefore, thesemiconductor device never protrudes and the flat panel display modulecan be made thin.

In this way, according to the present invention, the flat panel displaymodule can be made small and thin. Moreover, as mentioned above, toprevent break of the wiring line pattern due to the bending process, theflexible printed circuit board is previously bent. Thus, it is possibleto provide the flat panel display module which has sure connection in asmall number of steps.

What is claimed is:
 1. A flat panel display module comprising: atransparent substrate with a wiring line terminal section which isformed on one of surfaces of said transparent substrate in at least oneof opposing ends of said transparent substrate; a light emitting sectionprovided in a display region in a center section on said surface onwhich the wiring line terminal section of said transparent substrate isformed; a sealing cap provided for a sealing region to cover said lightemitting section such that ends of said sealing cap does not reach saidends of said transparent substrate or said wiring line terminal sectionof said transparent substrate; a flexible printed circuit boardconnected to said wiring line terminal section and extending along saidsealing cap of said transparent substrate; and a semiconductor devicemounted on said flexible printed circuit board for said light emittingsection; wherein said flexible printed circuit board is provided toextend along said transparent substrate and said sealing cap withoutbeing turned back.
 2. The flat panel display module according to claim1, wherein said semiconductor device is mounted on a side of saidflexible printed circuit board of said sealing cap.
 3. The flat paneldisplay module according to claim 1, wherein said flexible printedcircuit board has wiring line patterns for said semiconductor device onboth sides thereof in a portion corresponding to said display region. 4.The flat panel display module according to claim 1, further comprising:a frame provided along said end of said transparent substrate.
 5. Theflat panel display module according to claim 4, wherein said framesupports said flexible printed circuit board together with said end ofsaid sealing cap.
 6. The flat panel display module according to claim 1,wherein said wiring line terminal section is formed on both of saidsurface of said opposite ends of said transparent substrate, and saidflexible printed circuit board is connected with said both of saidwiring line terminal sections.
 7. The flat panel display moduleaccording to claim 1, wherein said wiring line terminal section isformed on both of said surface of said opposite ends of said transparentsubstrate, and said flexible printed circuit board is connected with oneof said wiring line terminal sections.
 8. The flat panel display moduleaccording to claim 1, wherein said light emitting section is an organicEL film.
 9. The flat panel display module according to claim 1, whereinsaid light emitting section is an organic EL film, the flat paneldisplay module further comprises a desiccant section between said lightemitting section and said sealing cap in a center section of saiddisplay region, said sealing cap has a protrusion section correspondingto said desiccant section, a plurality of said semiconductor devices areprovided on said flexible printed circuit board on a side of saidtransparent substrate between said protrusion section of said sealingcap and said end of said sealing cap.
 10. A flat panel display modulecomprising: a transparent substrate with a wiring line terminal sectionwhich is formed on one of surfaces of said transparent substrate in atleast one of opposing ends of said transparent substrate; a lightemitting section provided in a display region in a center section onsaid surface on which the wiring line terminal section of saidtransparent substrate is formed; a sealing cap provided for a sealingregion to cover said light emitting section such that ends of saidsealing cap does not reach said ends of said transparent substrate orsaid wiring line terminal section of said transparent substrate; aflexible printed circuit board connected to said wiring line terminalsection and extending along said sealing cap of said transparentsubstrate; and a semiconductor device mounted on said flexible printedcircuit board for said light emitting section; wherein said flexibleprinted circuit board is bent at least twice between said wiring lineterminal section and said display region such that said flexible printedcircuit board is approximately parallel to said transparent substrate insaid display region.
 11. The flat panel display module according toclaim 10, wherein said flexible printed circuit board is bent to a firstdirection opposite to said transparent substrate in a first positionbetween said wiring line terminal section of said transparent substrateand said sealing cap, is bent to said first direction in a secondposition between said first position and said terminal section of saidsealing cap, and is bent to the second direction opposite to said firstdirection in a third position between said second position and saidterminal section of said sealing cap.
 12. The flat panel display moduleaccording to claim 11, wherein a bending angle in said first position iswithin 60 degrees.
 13. The flat panel display module according to claim11, wherein in said first position, the wiring line pattern of saidflexible printed circuit board is formed only on one side.
 14. The flatpanel display module according to claim 11, wherein in said secondposition, said wiring line pattern of said flexible printed circuitboard is formed on both sides and a resist film is applied.
 15. The flatpanel display module according to claim 11, wherein a bending angle insaid second position is within 90 degrees and a summation of the bendingangle in said first position and the bending angle in said secondposition is equal to or less than 90 degrees.
 16. The flat panel displaymodule according to claim 11, wherein said flexible printed circuitboard is bent to said second direction approximately parallel to saidtransparent substrate in said third position.
 17. The flat panel displaymodule according to claim 11, wherein a metal film is formed on a backside of said flexible printed circuit board in one or both of saidsecond position and said third position.
 18. The flat panel displaymodule according to claim 11, wherein said flexible printed circuitboard is bent to said first direction opposite to said transparentsubstrate in a fourth position between said end of said sealing cap andsaid end of said light emitting section, is bent to said seconddirection opposite to said first direction in a fifth position betweensaid fourth position and said end of said light emitting section. 19.The flat panel display module according to claim 18, wherein in saidfourth position, said wiring line patterns of said flexible printedcircuit board are formed on both sides of said flexible printed circuitboard and a resist film is applied.
 20. The flat panel display moduleaccording to claim 18, wherein said flexible printed circuit board isbent to said second direction approximately parallel to said transparentsubstrate in said fifth position.
 21. A flat panel display modulecomprising: a transparent substrate having a plurality of wiring lineterminal sections disposed on a first surface of the transparentsubstrate, each of the wiring line terminal sections being arrangedalong a respective edge of the transparent substrate; a light emittingsection provided in a display region in a center section on the firstsurface of the transparent substrate; a sealing cap attached to thetransparent substrate so as to seal the light emitting section betweenthe transparent substrate and the sealing cap, the sealing cap and thetransparent substrate being sized so that edges of the sealing cap donot overlap said wiring line terminal sections of the transparentsubstrate; a flexible printed circuit board electrically connected toeach of the wiring line terminal sections and extending along saidsealing cap of said transparent substrate; and a semiconductor devicemounted on and electrically connected to said flexible printed circuitboard for said light emitting section, wherein said flexible printedcircuit board is provided to extend along said transparent substrate andsaid sealing cap without being turned back.
 22. The flat panel displaymodule of claim 21, further comprising a metal film disposed on a sideof the flexible printed circuit board that faces away from the sealingcap.
 23. The flat panel display module of claim 21, further comprising aresist film disposed on a side of the flexible printed circuit boardthat faces the sealing cap.
 24. The flat panel display module of claim21, wherein the transparent substrate comprises three of the wiring lineterminal sections arranged along three respective edges of thetransparent substrate.
 25. The flat panel display module of claim 21,further comprising a frame, the frame being attached so that theflexible printed circuit board is pressed between the frame and thesealing cap.
 26. The flat panel display module of claim 21, wherein anoutermost edge of the flexible printed circuit board is aligned with anoutermost edge of the transparent substrate.